| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board with which solder paste can be filled without generating air bubbles in solder paste printing. SOLUTION: The printed wiring board is provided with a conductor land of a soldering part of an electronic component, and a solder resist layer in which an opening is formed from which the conductor land is exposed. The opening is provided with a main opening from which a part of an upper face of the conductor land is exposed, and an auxiliary opening extended from an outer edge of the conductor land from the main opening. COPYRIGHT: (C)2008,JPO&INPIT
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