| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-to-substrate connection method capable of dealing with all substrate-to-substrate distances without changing a terminal width of a connection terminal, and to provide electronic equipment using this. SOLUTION: A substrate 1 and a substrate 2 are connected with each other by a process of connecting a connection terminal 3 having a spring 3a to the upper surface of substrate 1 surfaces; a process of disposing the substrate 2 having a through-hole 2a at a position of a distance D from the substrate 1; and a process of connecting a height correction conductive component 4 has both ends on the substrate 2 surface, and has a bottom 4a protruded from the through-hole 2a to make contact with the spring 3a for electrically connecting the substrate 2 surface and the spring 3a. COPYRIGHT: (C)2008,JPO&INPIT
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