| 摘要 |
PROBLEM TO BE SOLVED: To permit obtaining of a higher output in spite that a small size package consisting of a frame having a size same as a conventional example and a resin is employed. SOLUTION: The frame-package semiconductor laser device 10 is provided with a semiconductor laser diode chip 14, a main frame 16 having a chip mounting region 16a for mounting the semiconductor laser diode chip 14, a plurality of sub frames 17, 18 having wire bonding units 17a, 18a arranged so as to be approximated to the notch of the main frame 16, and a resin forming unit 15. In such a frame-package semiconductor laser device 10, respective opposing surfaces are formed so as to have the configuration of curved surfaces opposed to each other at positions whereat the chip mounting region 16a of the main frame 16 and wire bonding units 17a, 18a of the sub frames 17, 18 are opposed. COPYRIGHT: (C)2008,JPO&INPIT
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