发明名称 |
Electrolytic plating method |
摘要 |
A novel electrolytic plating method suitable for filling non-through holes with metal is disclosed. The electrolytic plating method uses a plating solution containing additives such as a surfactant, a brightening agent and a smoothing agent and includes pulse plating for controlling adsorption and desorption of tie additives on the surface and in the non-through holes of substrate and subsequent DC plating for filling up the non-through holes with metal.
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申请公布号 |
US2008023218(A1) |
申请公布日期 |
2008.01.31 |
申请号 |
US20070726992 |
申请日期 |
2007.03.23 |
申请人 |
NISHU KEISUKE;IIJIMA MORIO;ANDO NAOMI |
发明人 |
NISHU KEISUKE;IIJIMA MORIO;ANDO NAOMI |
分类号 |
H05K1/09;C25D3/38;H01L23/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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