发明名称 |
Plated Resin Molded Articles |
摘要 |
The present invention provides a plated resin molded article having a high adhering strength of a plating layer. Specifically, it provides a plated resin molded article that has a metal plating layer on the surface of a thermoplastic resin molded article comprising a composition that contains (A) 10 to 90 mass % of a matrix resin that has a water absorption after 24 hours in 23° C. water (ISO62) of at least 0.6% and (B) 90 to 10 mass % of a non-styrenic resin that has a water absorption after 24 hours in 23° C. water (ISO62) of less than 0.6%, wherein the thermoplastic resin molded article is not subjected to etching with a heavy metal-containing acid.
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申请公布号 |
US2008027165(A1) |
申请公布日期 |
2008.01.31 |
申请号 |
US20050586378 |
申请日期 |
2005.02.16 |
申请人 |
TAI TOSHIHIRO;GU WEIHONG;IZUMITANI TATSUO |
发明人 |
TAI TOSHIHIRO;GU WEIHONG;IZUMITANI TATSUO |
分类号 |
B32B15/08;C08F120/10;B05D3/00;C08F10/00;C08L101/00;C23C18/16;C23C18/24;C23C18/28 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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