发明名称 Plated Resin Molded Articles
摘要 The present invention provides a plated resin molded article having a high adhering strength of a plating layer. Specifically, it provides a plated resin molded article that has a metal plating layer on the surface of a thermoplastic resin molded article comprising a composition that contains (A) 10 to 90 mass % of a matrix resin that has a water absorption after 24 hours in 23° C. water (ISO62) of at least 0.6% and (B) 90 to 10 mass % of a non-styrenic resin that has a water absorption after 24 hours in 23° C. water (ISO62) of less than 0.6%, wherein the thermoplastic resin molded article is not subjected to etching with a heavy metal-containing acid.
申请公布号 US2008027165(A1) 申请公布日期 2008.01.31
申请号 US20050586378 申请日期 2005.02.16
申请人 TAI TOSHIHIRO;GU WEIHONG;IZUMITANI TATSUO 发明人 TAI TOSHIHIRO;GU WEIHONG;IZUMITANI TATSUO
分类号 B32B15/08;C08F120/10;B05D3/00;C08F10/00;C08L101/00;C23C18/16;C23C18/24;C23C18/28 主分类号 B32B15/08
代理机构 代理人
主权项
地址