CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM

摘要

Disclosed is a curable resin composition containing a copolymer having a monomer unit (A) containing an alkali-soluble group and a monomer unit (B) corresponding to a curable group-containing polymerizable unsaturated compound, and an organic solvent having a boiling point at atmospheric pressure of not less than 180°C. The ratio of the monomer unit (B) relative to the total monomer units constituting the copolymer is 5-95% by weight, and not less than 30% by weight of the monomer unit (B) is composed of a monomer unit corresponding to at least one compound selected from 3,4-epoxytricyclo[5.2.1.0<SUP>2.6</SUP>]decane ring-containing compounds. This curable resin composition enables to form a coating film excellent in transparency, heat resistance and the like. In particular, no partial variations in coating thickness or coating defects occur when a coating film is formed by a slit coating method or inkjet method by using this curable resin composition.