| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-layer wiring board in which high-density packaging is made possible by facilitating packaging of external electronic components. <P>SOLUTION: A CSP 10b is disposed so that its own connecting electrode 15b is positioned oppositely to a connecting electrode 15a of a CSP 10a, multi-layer circuit parts 21a, 21b are disposed to hold the CSP 10a, 10b therebetween, the connecting electrode 15a of the CSP 10a is connected to the multi-layer circuit part 21a, and the connecting electrode 15b of the CSP 10b is connected to the multi-layer circuit part 21b, thereby preventing warping from being incurred by concentrating wiring on one side of the multi-layer wiring board. <P>COPYRIGHT: (C)2008,JPO&INPIT |
