| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate that is excellent in semiconductor chip packaging. <P>SOLUTION: The wiring substrate has a base insulating film 111, a first wiring formed on the upper face side of the base insulating film 111, a via conductor formed in a via hole 113, in the base insulating film 111, and a second wiring on the lower face side of the base insulating film 111 connected to the first wiring through the via conductor. Additionally, the wiring substrate has the first wiring, the via conductor, and second wiring. Further, the substrate has a plurality of base substrate region units that are divided each other, a warpage control pattern on the base insulating film 111, and a warpage form in which at least a central portion of a pair of each side along the predetermined direction is grounded and both edges of the substrate are floating when disposing the wiring substrate on a horizontal board. <P>COPYRIGHT: (C)2008,JPO&INPIT |
