| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device and its manufacturing method which can prevent land exfoliation of the conductor land generated at the time of reflow by the side of the printed wiring board, while securing connection with the printed wiring board, even if electronic components has a high-density electrode. SOLUTION: The electronic component device comprises: an insulating substrate; a conductive land formed on this insulating substrate; an electronic components arranged on this conductive land; a non-conductive sheet fixed to the insulating substrate other than the conductive land for covering at least one portion of the periphery of the conductive land, and also for opening other portions of the conductive land; and a connection means for connecting the conductive land and the electronic components electrically, in the portion for opening the conductive land of this non-conductive sheet. COPYRIGHT: (C)2008,JPO&INPIT
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