| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a substrate provided with a through- electrode acquiring electric conductivity by reliably filling each through-hole with the plating, even in the case where diameter and shape of the holes bored to the substrate are fluctuated. SOLUTION: The method for manufacturing substrate comprises the steps of covering one surface of the substrate 10 on which a plurality of through-holes 12 are formed through the thickness direction with a conductive base material 14; conducting a first plating process to precipitate the plated part 16 within the through-hole 12 with the electrolytic plating, using the conductive base material 14 as an electrical power feeding layer for the plating and then allowing the plated part 16 to be protruded from an aperture of the through-hole; conducting the etching process from the other surface of the substrate 10 to remove the plated part protruded from the through-hole 12, and also partially removing the plated part 16 within the through-hole; conducting a second plating process to form a plated part 17 to the through-hole 12 integrated to the plated part 16 within the through-hole 12 with the electrolytic plating, using the conductive base material 14 as the power feeding layer for the plating and filling the through-hole 12 with the plated parts 16 and 17; and removing the conductive base material 14 from the substrate 10. COPYRIGHT: (C)2008,JPO&INPIT
|
