| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly sealed electronic component by preventing entry of resin into a function part provided among members, effectively releasing the air within a cavity to external side, and thereby achieving adequate and easier sealing of resin material. SOLUTION: A soft resin material 42 is pressed with a pressing unit 33. In this case, the pressing force of the pressing unit 33 to the resin 42 is regulated so that the resin 42 cannot enter a region of a comb shape electrode provided in a gap B between a base substrate 12 and a mounting substrate 41. Moreover, the entire part of the lower surface 34a of an external frame 34 is formed as an air releasing part (air-vent) 50 in order to effectively escape the air within a cavity 33a to the external side. COPYRIGHT: (C)2008,JPO&INPIT
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