发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which is capable of heat dissipation with high efficiency, and is light-weighted, thin and inexpensive. SOLUTION: The wiring board consists of a metallic layer 1 made of a metallic foil and an insulation layer 2 made of a polyimide film, and these are stacked. A wiring pattern is formed on the metallic layer 1. The board is fixed to a heat dissipating material 10 made of metal or the like in order to efficiently dissipate heat due to self-heating or the like. Since the insulation layer 2 is fixed to the heat dissipating material 10, insulation can be secured between the metallic layer 1 and the material 10. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008021728(A) 申请公布日期 2008.01.31
申请号 JP20060190592 申请日期 2006.07.11
申请人 NSK LTD 发明人 SEKINE TAKAAKI
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址