发明名称 METHOD OF FORMING CONDUCTOR PATTERN, PROCESS FOR PRODUCING RESIN SUBSTRATE WITH USE OF THE METHOD, AND RESIN SUBSTRATE
摘要 <p>A method of forming a conductor pattern, in which a conductor pattern formed on a support plate can be completely transferred from the support plate into a resin layer, and in which the step of roughening the surface of conductor pattern can be avoided to thereby attain reduction of production cost. In the method of forming a conductor pattern, there is provided conductor pattern (12) of overhung section having small-diameter part (12A) and large- diameter part (12B) superimposed on the superior surface of support member (100) sequentially from the superior surface toward vertical above. Subsequently, semi-hardened resin layer (110) is applied onto the support member (100), so that the conductor pattern (12) of overhung section is embedded in the resin layer (110), and the semi-hardened resin layer (110) is completely hardened. Thereafter, the resin layer (110) is detached from the support member (100) with the use of the large-diameter part (12B) of the conductor pattern (12) of overhung section as an anchor, so that the conductor pattern (12) of overhung section is transferred from the support member (100) into the resin layer (110).</p>
申请公布号 WO2008012973(A1) 申请公布日期 2008.01.31
申请号 WO2007JP59753 申请日期 2007.05.11
申请人 MURATA MANUFACTURING CO., LTD.;ARAI, MASASHI 发明人 ARAI, MASASHI
分类号 H05K3/20 主分类号 H05K3/20
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