CHEMICAL MECHANICAL POLISHING PADS COMPRISING LIQUID ORGANIC MATERIAL CORE ENCAPSULATED IN POLYMER SHELL AND METHODS FOR PRODUCING THE SAME

摘要

There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130 0C or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.