Power semiconductor module assembling arrangement, has area of terminal contacts aligned parallel towards lower side of module housing such that contacts form angle of preset degrees to lower side of housing

摘要

The arrangement has a power semiconductor module (3) with terminal contacts (15) which are led through a module housing (40). An insulator frame (60) is arranged between the contacts and a cooling unit, runs parallel to the contacts, and limits insulation at the housing. The frame has an opening (61) and an area (62) that follow areas (16, 17) of the contacts. The area (16) of the contacts is aligned parallel to a lower side (50) of the housing such that the contacts form an angle of greater than 180 degrees to the lower side of the housing. An independent claim is also included for a method for mounting a power semiconductor module in a cooling element.