RELEASE FILM FOR MANUFACTURE OF PRINTED WIRING PLATE

摘要

This invention provides a release film for use in pressing working of printed wiring boards, flexible printed wiring boards, multilayer printed wiring plates or other printed wiring plates, for preventing adhesion between a press hot plate and the printed wiring plate or cover lay film. The release film has excellent heat resistance, releasability, noncontamination properties, circuit pattern conformability, and workability in the pressing, and is small in environmental load in waste disposal. The release film comprises at least one thermoplastic resin layer having a modulus of elasticity in shear in the range of 5 x 10⁵ to 10⁷ Pa at a hot press lamination temperature, and at least one metal layer superimposed on top of each other.