HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To improve easiness in handling of metal substrates on which circuit substrates 10 having hybrid integrated circuits are arranged in a matrix.

SOLUTION: A hybrid integrated circuit device comprises: one metal substrate; conductive patterns 12 arranged on the metal substrate, where the conductive pattern 12 for a hybrid integrated circuit is insulated from the metal substrate; circuit element 13 mounted/electrically-connected on/to the conductive pattern 12; and grooves 20 formed on the back of the metal substrate on the borderline between the patterns of the hybrid integrated circuits with a depth less than the thickness of the metal substrate. This allows the hybrid integrated circuit device to be handled as one sheet.

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