MICROELECTRONIC PACKAGE HAVING A BUMPLESS LAMINATED INTERCONNECTION LAYER

摘要

A MICROELECTRONIC DEVICE FABRICATION TECHNOLOGY THAT PLACES AT LEAST ONE MICROELECTRONIC DIE (214) WITHIN AT LEAST ONE OPENING IN A MICROELECTRONIC PACKAGE CORE (202) AND SECURES THE MICROELECTRONIC DIE/DICE (214) WITHIN THE OPENING(S) WITH AN ENCAPSULATION MATERIAL (222), THAT ENCAPSULATES AT LEAST ONE MICROELECTRONIC DIE (214) WITHIN AN ENCAPSULATION MATERIAL (222) WITHOUT A MICROELECTRONIC PACKAGE CORE (FIG. 20), OR THAT SECURES AT LEAST ONE MICROELECTRONIC DIE (214) WITHIN AT LEAST ONE OPENING IN A HEAT SPREADER (302, FIG 34). A LAMINATED INTERCONNECTOR (130) OF DIELECTRIC MATERIALS AND CONDUCTIVE TRACES IS THEN ATTACHED TO THE MICROELECTRONIC DIE/DICE (214) AND AT LEAST ONE OF THE FOLLOWING: THE ENCAPSULATION MATERIAL (222), THE MICROELECTRONIC PACKAGE CORE (202), AND THE HEAT SPREADER (302), TO FORM A MICROELECTRONIC DEVICE.FIG.17