| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component device which secures the connection of a positive bump electrode by preventing the underfill from running off mounting regions such as BGA and flowing out outside, irrespective of low or high viscosity. <P>SOLUTION: The electronic component device comprises: an area array 9; an insulating board for laying the area array; two or more conductor lands 2 allocated in a prescribed position on the insulating board; a bump electrode 8 of two or more area arrays installed corresponding to the conductor land; an electric connection means 6 for making the electric connection of the bump electrode and the conductor land; a non-conductive sheet 7 which is provided on the insulating board sandwiched by the insulating board and the area array, has a via hole to the region of the electric connection means, and prepares a bending curvature portion 7a in the mounting region exterior of the area array; and the underfill 10 which is dammed up by the bending curvature of the non-conductive sheet, while being injected into the clearance between this non-conductive sheet and the area array and filled up in the via hole of the non-conductive sheet. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
