| 摘要 |
PROBLEM TO BE SOLVED: To restrain the stress of a wafer occurring, in the support plate, a carrying device, a peeling device, and a peeling method, when peeling the wafer from a support plate on which a through-hole is formed. SOLUTION: The support plate 1 supports the wafer. On the support plate 1, a plurality of through-holes 3 are formed in a thickness direction. The support plate 1 has a band-like or an island-like flat section 4 on which no through-holes 3 are formed. COPYRIGHT: (C)2008,JPO&INPIT |
