| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing container for semiconductor wafers which can meet demands of high microfabrication of a circuit, prevent contamination of the semiconductor wafers, and effectively suppress generation of particles. SOLUTION: The container is provided with a front open-box container body 1 for arranging and housing a plurality of semiconductor wafers W, and a lid used for opening and closing an opening front portion of the container body 1 via a seal gasket for sealing and closing. A region 20 of the container body 1 contacting the semiconductor wafers W is coated with a diamond-like carbon to give contamination resistance and conductivity. Since the region 20 of the container body 1 contacting the semiconductor wafers W is coated with the diamond-like carbon to modify a surface to give contamination resistance, conductivity, and abrasion resistance; the contamination of the semiconductor wafers W can be effectively suppressed while meeting the demands for microfabrication of a circuit in recent years. Further, antistatic based on conductivity can effectively prevent static electricity destruction and the generation of particles. COPYRIGHT: (C)2008,JPO&INPIT |
