发明名称 |
HEAT CONDUCTING BASE BOARD, MANUFACTURING METHOD THEREOF, POWER SUPPLY UNIT, AND ELECTRONIC EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat conducting substrate hardly influenced by a noise, to provide a manufacturing method thereof, to provide a power supply unit, and to provide electronic equipment. SOLUTION: The heat conducting base board consists of a metal plate 17 having one or more holes, a sheet-like heat transfer resin layer 11 fixed on the metal plate 17, a lead frame 10 embedded in the heat transfer resin layer 11, and a printed wiring board 20 provided in the hole of the metal plate 17. Pins 13 are provided on a portion facing the holes of the lead frame 10, and the pins 13 pierce through the heat transfer resin layer and are electrically connected to the printed wiring board. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008021818(A) |
申请公布日期 |
2008.01.31 |
申请号 |
JP20060192318 |
申请日期 |
2006.07.13 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TSUJIMOTO ETSUO;TSUMURA TETSUYA;NISHIYAMA KIMIHARU |
分类号 |
H05K7/20;H01L23/36;H05K1/02;H05K9/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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