发明名称 MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus which keeps structure and work sequence simple, and is also applicable to molding a mold part with a lead whose cross section and external diameter are not consistent. SOLUTION: The molding apparatus 1 includes a bottom mold 10 and a top mold 20 each having cavities 11, 21 and peripheral side parts 12, 22 encircling them. The peripheral side part 12 has a receiving hole 15 to receive resilient members 41, the receiving hole 15 having peripheral walls 27. The front wall 27a and the back wall 27a of the peripheral wall 27 have recess 27e so that a litz wire 32 goes through it in the closed form. The resilient member 41 protrudes beyond the peripheral wall 27 into the closing direction in the open form. In the closed form, the counter resilient members 41, 43 and 42, 44 being compressed in contact with each other in the opening and closing directions, the recess 27e is sealed and the litz wires 32 and 33 are clamped therein. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008018692(A) 申请公布日期 2008.01.31
申请号 JP20060194667 申请日期 2006.07.14
申请人 TOSHIBA TEC CORP 发明人 SUGISAWA MASAAKI
分类号 B29C33/12;B29L31/34 主分类号 B29C33/12
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