| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board wherein electronic components can easily be exfoliated from a board member even when the mount strength of the electronic components mounted on the board member is supplemented by a resin part, and to provide a mobile terminal. SOLUTION: The circuit board 10 is formed by forming a circuit pattern 12 onto the board member 11, and terminals 14A are fixed to the circuit pattern 12 by means of solder 13 to mount the electronic components 14. In the circuit board 10, a first resin 15 is laminated on the board member 11, the first resin 15 covers the circuit pattern 12 and the solder 13, a second resin 16 is laminated on the first resin 15, and the second resin 16 covers a main body 14B of each electronic component 14. When the first resin 15 is heated to the lowest heat-resistant temperature T or below among heat-resistant temperatures of the electronic components 14, the elastic modulus of the first resin 15 reaches a prescribed value or below, which is lower than the elastic modulus before the heating. COPYRIGHT: (C)2008,JPO&INPIT
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