Method for production of integrated circuit, involves continuous making of flexible substrate having conductive strip structure, where flexible integrated circuit is connected with conductive strip structure of flexible substrate

摘要

The method involves continuous making of a flexible substrate (120) having a conductive strip structure (130). The flexible integrated circuit (140) is connected with the conductive strip structure of the flexible substrate. The circuit attached to the flexible substrate, is covered with another flexible substrate (160). Recess (165) is produced in the former flexible substrate or in the later flexible substrate. The recess makes the conductive strip structure, accessible. A flexible foil is supplied continuously as the later flexible substrate, with or without recess.