MEHRSCHICHTMATERIAL MIT NIEDRIGER WÄRMEAUSDEHNUNG

摘要

A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150 DEG C is not higher than 20 x 10<-6>/ DEG C can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.