| 摘要 |
<p>The invention provides a chemical-mechanical polishing composition comprising silica, a compound in an amount sufficient to provide 0.2 mM to 10 mM of a metal cation selected from the group consisting of gallium (III), chromium (II), and chromium (III), and water, wherein the polishing composition has a pH of 1 to 6. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.</p> |
