发明名称 |
Bearbeitungsverbund für ein Substrat |
摘要 |
Composite comprises a substrate, especially a thin substrate (2) with a thickness of less than 0.3 mm, and a support substrate (1) connected at least indirectly to the substrate. A spacer layer (3) with recesses is arranged between the substrate and support substrate. The recesses are provided at least in the surface of the spacer layer facing the substrate. - An INDEPENDENT CLAIM is also included for a process for treating, processing and/or transporting a substrate, especially a thin substrate with a thickness of less than 0.3 mm. Preferred Features: The spacer layer is made of a plastic, polymer or glass, or a material containing a plastic, polymer or glass. The support substrate is made of glass or a material containing glass. |
申请公布号 |
DE10348946(B4) |
申请公布日期 |
2008.01.31 |
申请号 |
DE2003148946 |
申请日期 |
2003.10.18 |
申请人 |
SCHOTT AG;TPO HONG KONG HOLDING LTD. |
发明人 |
HERMENS, HARRIE;PLICHTA, ARMIN;ZETTERER, THOMAS;BOMMEL, MARK VAN |
分类号 |
B32B3/10;G02F1/1333;B32B3/18;B32B3/22;B32B3/24;B32B3/26;B32B7/06;B32B17/00;B32B17/06;B32B17/10;C03C27/12;G02F1/13 |
主分类号 |
B32B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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