APPARATUS AND METHOD FOR TESTING IMAGE SENSOR PACKAGE

摘要

An apparatus and a method for testing an image sensor package is provided to conduct electric test and image test at a wafer level of the image sensor package before a camera module is assembled. A package wafer(40W) composed of plural image sensor packages is held by a jig(100). A socket base(240) is moved up and down to the package wafer to come in contact with one surface of the image sensor package to be inspected. A socket cover(340) is moved up and down to the package wafer to pressure the other surface of the image sensor package. A light source(322) is provided on the other surface of the image sensor package. The jig is moved in a transverse direction, and the socket cover is disposed above the socket base.