发明名称 Thin film photovoltaic module wiring for improved efficiency
摘要 The present invention relates to configuring and wiring together cells in TF PV modules. According to one aspect, cells are fabricated on one plane on a top surface of a substrate, with wiring patterned on a parallel plane, and vias formed to provide connections between the cell plane and wiring plane. In one embodiment, the wiring plane is on the back surface of the substrate and vias are formed through the substrate. In another embodiment, the wiring plane is on the top surface of the substrate underneath the cell plane and an insulating layer, with the vias formed through the insulating layer. In another embodiment, the cell plane formed on the top surface includes superstrate cells that are illuminated through a transparent substrate, with an insulator between the cell plane and an upper wiring plane. According to another aspect, the heavy bus bar connections in the wiring plane can carry large currents and do not block light impinging on the cells. According to further aspects, the wiring plane enables use of parallel cell connections that provide immunity to shading, as described above. Moreover, these connections can be wired in a variety of methods, allowing use of series-parallel arrangements so that, for example, local regions could be parallel connected while larger regions series connected.
申请公布号 US2008023065(A1) 申请公布日期 2008.01.31
申请号 US20060492277 申请日期 2006.07.25
申请人 BORDEN PETER G;EAGLESHAM DAVID J 发明人 BORDEN PETER G.;EAGLESHAM DAVID J.
分类号 H01L31/00 主分类号 H01L31/00
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