| 摘要 |
Example embodiments relate to an interconnection substrate and a semiconductor chip package and a display system including the same. The interconnection substrate may include a base film, a signal line provided on the base film, a power line provided on the base film as a line pattern including a plurality of bent portions, and a ground line provided on the base film in parallel with the power line. The interconnection substrate may further include a semiconductor chip provided on the base film, wherein the power, ground, and/or signal lines are electrically connected to the semiconductor chip to form a semiconductor chip package. A display system may include the above semiconductor chip package, a screen displaying an image, and a PCB generating a signal. The semiconductor chip may be connected between the PCB and the screen and relay the generated signal from the PCB to the screen. Use of the power, ground, and/or signal lines having a plurality of bent portions may reduce electromagnetic interference (EMI) within the display system.
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