| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an alkali developable photocurable and thermosetting one-pack type solder resist composition having excellent coating film properties of heat resistance, adhesivity, electroless gold plating resistance and electric properties and excellent dry tack and workability and a printed wiring board using the same. <P>SOLUTION: The one-pack type solder resist composition comprises (A) a carboxy group-containing photosensitive resin which is obtained by adding a compound (c) containing both a cyclic ether group and an ethylenic unsaturated group in one molecule to a copolymer composed of an unsaturated carboxylic acid (a) and a compound (b) containing an ethylenic unsaturated group except the unsaturated carboxylic acid and has a softening point of 130-200°C, (B) a diluent, (C) a photopolymerization initiator, (D) a melamine or its organic acid salt and (E) an inorganic filler. The printed wiring board is obtained by using the composition. <P>COPYRIGHT: (C)2008,JPO&INPIT |
