| 发明名称 |
COMPONENT PACKAGING APPARATUS, SYSTEMS, AND METHODS |
| 摘要 |
Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.
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| 申请公布号 |
US2008023817(A1) |
申请公布日期 |
2008.01.31 |
| 申请号 |
US20070866795 |
申请日期 |
2007.10.03 |
| 申请人 |
INTEL CORPORATION |
发明人 |
KONING PAUL;MATAYABAS JAMES C. |
| 分类号 |
H01L23/48;B05C1/00;B05D3/12;H01L21/44;H05K1/03;H05K3/00;H05K3/10;H05K3/12;H05K3/46 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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