| 摘要 |
The present invention relates to a stress-free lead frame ( 1 ) for a semiconductor. The stress-free lead frame ( 1 ) is provided with a stress-relief means ( 15 ) and an interlocking means ( 16 ) at the outer periphery. The stress-relief means ( 15 ) is capable of accommodating expansion and compression while the interlocking means ( 16 ) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame ( 10 ).
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