| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which has a good energy efficiency and a good solder wicking property, and to provide a method of mounting the circuit board. SOLUTION: The circuit board 100 comprises an electronic component 20 having a plurality of leads 21 and a printed substrate 10 for mounting the electronic component 20 mounted thereon. The printed substrate 10 has circuit patterns 11, an interlayer insulating layer 12 positioned between the circuit patterns 11, a through-hole 13 passed through the printed substrate 10, and a metal ring 15 passed through the printed substrate 10 to surround the through-hole 13. In the circuit board 100 upon preheating operation prior to soldering operation, a high frequency bias is applied to an induction heating coil 41 to heat the metal ring 15 based on elecromagnetic induction. As a result, the through-hole 13 is heated with the metal ring 15 as a heat source. COPYRIGHT: (C)2008,JPO&INPIT
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