Imaging thin film structures by scanning acoustic microscopy

摘要

A method and apparatus for Scanning Acoustic Microscopy (SAM) for testing of a semiconductor device having a first surface and a second surface with bonding features secured to said first surface are provided. An impervious fixture comprising a dam or a tank retains acoustic transmission fluid in contact with the second surface. Acoustic transmission fluid is excluded from admission to the space surrounding the bonding features where an atmosphere of gas or a vacuum is provided by isolating the first surface from the acoustic transmission fluid either by providing a sealed chamber protecting the first surface or by providing a dam surrounding the second surface.