INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME

摘要

A printed wiring board including a substrate, conductor circuits and interlayer dielectric layers stacked alternately on the substrate, each of the interlayer dielectric layers including a curable resin having flaky particles dispersed therein, and viaholes formed in the interlayer dielectric layers and electrically connecting the conductor circuits at different levels.