发明名称 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON
摘要 A method of manufacturing an electronic device ( 10 ) provides a substrate ( 20 ) that has a plastic material. A particulate material ( 16 ) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate ( 20 ).
申请公布号 US2008026581(A1) 申请公布日期 2008.01.31
申请号 US20060461080 申请日期 2006.07.31
申请人 EASTMAN KODAK COMPANY 发明人 TREDWELL TIMOTHY J.;KERR ROGER S.
分类号 H01L21/302 主分类号 H01L21/302
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