| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having a highly accurate via though the via is extended to two or more insulating layers and capable of achieving high density of wires and vias. SOLUTION: In the multilayer wiring board comprising a plurality of wiring layers 13a to 13e, a plurality of inter-layer insulating films 15ab, 15bc, 15cd, 15de vias 17 for connecting adjacent wiring layers, and a via 17' for connecting upper and lower wiring layers through two or more inter-layer insulating films; at least a part of the inter-layer insulating films is formed by an inorganic insulating film, and the via 17' for connecting the upper and lower wiring layers through two or more inter-layer insulating films is formed as a single via penetrated into the inter-layer insulating films all of which are formed by inorganic insulating films. Preferably, all the inter-layer insulating films are made of inorganic insulating films and the inorganic insulating films are formed by a low temperature CVD method. Preferably, the thickness of each inorganic insulating film is 0.5 to 2.0μm. COPYRIGHT: (C)2008,JPO&INPIT |
