| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board and a method of manufacturing a multilayer wiring circuit board which can achieve a good continuity between wiring formed on an insulating film and an electronic component, when the insulating film is formed around the electronic component by a fluid-drop ejecting method. SOLUTION: Electronic components 20, 21 having conductors 20a, 21a are located on a substrate 10 with the conductors 20a, 21a upwardly directed, and conductive projections 12 are provided on the conductors 20a, 21a. An insulating material is applied on the surroundings of the electronic components 20, 21 so as to have nearly the same height as the electronic components 20, 21, and the insulating material is set to form an insulating film 13. Wiring lines 15 are formed on the insulating film 13 to be connected to the projections 12. COPYRIGHT: (C)2008,JPO&INPIT
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