| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board mounting method that strengthen a bonding force of an adhesive with a simple configuration, while minimizing a cost increase in the printed circuit board mounting method for fixing a member onto a printed circuit board by using an adhesive. SOLUTION: The printed circuit board mounting method forms unevenness on a part of the printed circuit board 10 where the adhesive 12 is applied. COPYRIGHT: (C)2008,JPO&INPIT
|
