| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a circuit board in which a floating island conductor pattern is sealed within the range of plate thickness. SOLUTION: A circuit board where a floating island conductor pattern 12 is sealed within the range of plate thickness is produced by forming a substrate recess 2 corresponding to the plate thickness of the conductor pattern 12 in a work W, resin sealing the substrate recess 2 and then removing a substrate thin portion 4 interconnecting substrate protrusions 3 from the work W by etching. COPYRIGHT: (C)2008,JPO&INPIT
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