发明名称 HEAT SINK, AND ITS FIXING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heat sink which can be fixed easily with excellent fixing quality, and to provide its fixing method. SOLUTION: In a heat sink 3 being fixed to the heat generator 2 of a heat generating body 1, a thermosetting thermally conductive adhesive layer 4 of solidified state under room temperature is provided previously on the fixing surface 5a on the heat sink 3 side. An adhesive component composing the thermosetting thermally conductive adhesive layer is produced by mixing 2-50 pts.wt. of aromatic amine-based curing material, 1-20 pts.wt. of complex amine-based or imidazole-based curing accelerator, and 20-300 pts.wt. of high thermal conductivity filler for 100 pts.wt. of epoxy resin. Under a state where the fixing surface 5a of the heat sink 3 is applied to the heat generator 2 of the heat generating body 1 and pressed against the heat generator, the thermosetting thermally conductive adhesive layer 4 is melted and heat cured. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008021695(A) 申请公布日期 2008.01.31
申请号 JP20060190004 申请日期 2006.07.11
申请人 SATSUMA SOKEN KK 发明人 FURUKAWA MASAJI;YAMAGUCHI HAJIME;HIRAMINE MIYOKO
分类号 H01L23/40 主分类号 H01L23/40
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