| 发明名称 |
Chip on flexible printed circuit type semiconductor package |
| 摘要 |
A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.
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| 申请公布号 |
US2008023822(A1) |
申请公布日期 |
2008.01.31 |
| 申请号 |
US20070878016 |
申请日期 |
2007.07.20 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE SI-HOON;KANG SA-YOON;CHOI KYOUNG-SEI |
| 分类号 |
H01L23/14 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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