发明名称 |
BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME |
摘要 |
A wire-bonding substrate is disclosed. The wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate is also disclosed. The process includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package is also disclosed that includes coupling the die to the wire-bond pad. A computing system is also disclosed that includes the wire-bonding substrate.
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申请公布号 |
US2008023820(A1) |
申请公布日期 |
2008.01.31 |
申请号 |
US20070866239 |
申请日期 |
2007.10.02 |
申请人 |
INTEL CORPORATION |
发明人 |
TAGGART BRIAN;APREITZER RONALD L.;NICKERSON ROBERT |
分类号 |
H01L23/04;H01L23/498;H05K1/11 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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