| 摘要 |
An assembly of a probe pin and a probe pin bar for testing a wafer is provided to prevent a metal pad of a semiconductor chip from being broken by forming plural spines on upper and lower portions of a beam portion of an upper probe pin. An upper probe pin(5) has a beam portion(1), a support(2) and a connection(3), and the upper probe pins are arrayed at regular intervals by an upper alignment member(10). A circuit board block(15) is integrally bonded to a bottom surface of the upper aligning member, and lower probe pins(20) are arrayed in regular intervals on a bottom surface of the circuit board block, and are communicated with the upper probe pins. The support is formed in a matching groove(2a), and the connection has cut portions(3a) spaced at regular intervals at a center of a bottom surface of the support.
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