| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein a burr is made because of formation of a through hole when a conductor arranged inside of a raw multilayer collective circuit is exposed by forming the through hole on a dividing line, while applying a so-called non-shrink process and taking many pieces and manufacturing a multilayer ceramics substrate by applying a method with the conductor as an external electrode, as for a method of producing the multilayer ceramics substrate which divides the multilayer collective substrate. SOLUTION: In the case of boring the through hole 39 in a laminating direction from the side of the first shrink suppressing layer 36 of a raw composite laminated body 38, the thickness of a second shrink suppressing layer 37 to be as thin as≤300μm in such manner that a droop 42 is not generated much at a ceramic green layer 23 in contact with this second shrinkage suppressing layer 37. Thus, the burr 45 is not generated much. COPYRIGHT: (C)2004,JPO&NCIPI |
