Method for forming packaged microelectronic devices and devices thus obtained

摘要

The present invention provides a packaged microelectronic device (20) comprising at least one electrode (10) comprising a chip (18) embedded in a package. The chip (18) comprises a back electrode (17) located at a first side of the chip (18), and electronic circuitry (14) located at a second side of the chip (18), the second side being opposite to the first side, and wherein the back electrode (17) is part of the package. The present invention furthermore provides a method for forming such packaged microelectronic devices (20).