| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for arranging 20-30 thousands of solder balls at a time through simple work and a method for forming bumps on the entire region even of an 8 inch wafer by single work. SOLUTION: A work 2 provided with pads 2a is previously coated, on the surface thereof, with flux 4 by a specified thickness and secured to a base 1. An arranging mask 6 provided with mask holes 6a of larger diameter than a solder ball 7 at positions corresponding to the pads 2a on the surface of the work 2 is positioned vertically such that the lower surface of the arranging mask 6 does not touch the flux 4 and positioned horizontally such that the mask holes 6a correspond to the pads 2a. After solder balls 7 are fed to the mask holes 6a, the arranging mask 6 is moved upward and removed. In this regard, the solder balls 7 are advantageously pressed toward the flux 4. |
