摘要 |
<PICT:0948450/C1/1> <PICT:0948450/C1/2> <PICT:0948450/C1/3> In a method, Fig. 1, of assembling parts of semi-conductor devices, a glass tube 1 is centred (a) round a metal pin 5, into a recess 7 of which a disc 6 on the end of a wire 2 is placed and centred (b); tube, pin and wire are rotated and heat is supplied (c) to the glass, to seal the tube to the wire, and to the pin to prevent cooling; the pin is lowered and a gas is supplied (e) through a bore 9 in the pin, to reduce any oxide formed on the wire in the tube. The pin may be lowered in two stages (d) and (e), the wire following the pin in the first stage whilst the seal 10 is plastic and separating from it in the second stage when the seal hardens. A device, Figs. 2 and 3, for carrying out this method comprises a plurality of rotary heads 36 arranged in a circle on a rotary table. Each head comprises a rotary part 11 supported by balls 14 in a stationary part 12. A device 43 continuously supplies wires from holders 39 on a guide track 38 and a device 45 supplies glass tubes to the heads, which are moved step-by-step as the assembly proceeds; and the finished parts are replaced on the guide track by a lever 44. An electromagnetic safety device 42 prevents supply of a new tube or wire if any parts have remained in the head. Tongs 4, 16 support and centre the glass tube on a surface 15 and the wire is centred and held in position on the pin 5 by an arm 29. The wire and the tube are rotated together as they pass a series of burners mounted on a segment 52. Raising of a conical sleeve 19 by means of a cam 21 causes a lever 22 to be displaced, thereby turning shafts 17 and 18 to separate the tongs to allow admittance and removal of the glass tube. Means is provided to raise and lower pin 5 in stages. |